LED lamps and LED lights

Figure LED lamps structure of the development process

Film chip technology (Thinfilm) is the production of ultra bright LED chips key technology, can reduce the lateral out light loss, through the bottom reflective surface can make more than 97% of the light from the output (figure 2), not only greatly improve LED efficiency, also simple lens design.

Figure 2 common LED and BoJi technology of the positive rate of light LED comparison

Three big packaging technologies is introduced

High power LED packaging technology for single chip can distinguish integration and chip board chip packages three categories, the following will show.

The luminous efficiency, heat dissipation, reliability for single chip packages advantage

Single chip packages are packaging technology application in most, its main technical bottleneck in chip yield, the color temperature control and phosphor coating technology, and Osram onto semiconductors of Rechargeable LED light, by silica packaging, packaging appearance and internal briefly the structure as showed in figure 3 below. This LED the beam of light has 170 degree angle, can cooperate with ideal second optical lens or reflective glass. The silicon lens has high temperature resistant and low attenuation characteristics. The unique packaging design further enhances the heat dissipating performance of LED, make the product of the thermal resistance control in each tile 6.5 or so, help to lower the heat resistance. In addition, the specific configuration makes phosphor LED color temperature cover cold white, neutral white gentle white range. Single chip packages’ advantage lies in the high efficiency, easy heat dissipation, easy to light distribution and reliability.